Die Bonding
Perfomance is COST
We give you BOTH
LD microprecision designs, manufactures and market a wide range of die bonding tools and accessories applicable to most type of die bonders in the market today.
  • Push Up Needles
  • Rubber Collets
  • Hi-Temp Collets
  • Die Collets
  • Dispensing Tools
  • Stamping Tools
ld die process

Our product help customers to improve productivity, reduce cost and most importantly solve process related problems.
As the wafer is getting thinner to less than 50microns, it poses a new challenge to die bonding in avoiding crack or chips. We have done extensive research and introduce the solution tool to minimize the crack die tremendously. Refer to our “Solution tools” for details.
ld diebonding 02
Complex grinding capability to produce high performance tools
In nano technology, small is beautiful.
That’s what we do.
We also provide design to customers specifications.
For detail, please contact : sales@ld-micro.com