In die bonding, epoxy deposition onto the substrate prior to die placement is very critical and challenging especailly when it is prone to "delamination" resulting in the product reliability or even failure.
Poor or incomplete epoxy dispensing with voids will create trapped gases during curing between the substrate and benealth the die. It should be avoided.
At LD Microprecision, we optimize the dispensing nozzles design in both patterns and tubing size selections that can voids.
Other design consideration include the controlling the amount of epoxy deposition limit the fillet height of less 50% of die thickness.
Tubing Pattern Design
Tubing Size Selection
Epoxy Coverage (%)
Bond Line Thickness
In nano technology, small is beautiful. That’s what we do.
We also provide design to customers specifications. For detail, please contact : email@example.com