Cold Bump Pull
LD Microprecision achieved technical breakthrough in the field of complex ultrafine processes manufacturing know-how to produce the tweezer pull with tight tolerance and uncompromising performance results. Application for both solder bump and Wire Bond ball bond vertical pull.
Ball/Die Shear
Ball Shear testing is used to assess the integrity of the gold ball-to-bonding pad interface in the gold ball bonding process. A shear tool moves parallel to the bonded surface and shears the ball bond. We provide various type of ball shear to meet customers’ different bond tester such as DAGE, XYZ, Royce, Rhesca and etc.