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Epoxy Dispensing Tool
Die BondingEpoxy dispensing tools deposit epoxy onto the die pad before a pick-up tool places a die on it. The dispensing tool has basically 2 parts - a stem with a luer-lock head which goes into the syringe containing the epoxy, and a body which has reservoir to contain the epoxy in the dispensing tool. The dispensing tools comes in different shapes.
Please contact our sales representative for customize or special design request. -
Epoxy Stamping Tool
Die BondingStamping tools are also called as transfer or printing tools because they really stamp epoxy onto the pad. Unlike the dispensing tool, the epoxy does not flow through the part and onto the pad. The tools pick up epoxy from an epoxy tray and stamps the epoxy down on to the pad. The tools come in various design such as deep groove, cross, star and single dot.
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High Temperature Pick Up Tool
Die BondingThe Hitemp plastic pick up tools serve the purpose for assembling the small dice especially for die sizes < 25mil. The plastic material is harder then rubber material. This makes it possible to machine the tip to very small and close tolerances to enable accurate placement capabilities. LD Microprecision design, manufacture and market wide range of high-temperature pick up tool with hole size down to 80 micro & tight tolerance spec.
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Hybrid Rubber Collet
Die BondingHybrid Rubber is one of our patented product. This collet provide easy, and reliable technique for lifting thin fragile and uneven surface die. Hybrid rubber tip can solves stack die, sticky die and foreign particles on die, and missing die issue. Other than that, its lifespan is longer than normal rubber collet.
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Needle Holder & Pepperpot
Die BondingWe can design the needle holder and pepperpot according to customers' die bonding machine type, chip size and also with customers' special requirements. We can support to following die bonders now: ASM / ESEC / Datacon / Panasonic and etc.
Please contact our sales representative for more information about Pepperpot and Needle Holder configuration.
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Push Up Needle
Die BondingPush up needle is mostly used in die bonding and die sorting process. Our micro grain material ensures long life application. The polished spherical tip minimized chip or crack die related problem. Full range of tip configurations are manufacture for various applications.
Material : Tungsten Carbide, High Speed Steel, Stainless Steel, Plastic Tip Shank Diameter : 0.70mm , 0.68mm, 0.50mm, 0.40mm Please contact our sales representative for customize or special design request. -
Rubber Collet
Die BondingRubber collet is the most commonly used pick-up tool in the industry. The material is non-conductive and anti-static. Our wide range of rubber pick up tool are widely used in die pick, we provide variety of size to meet different application for normal temperature and high temperature with hole size down to 80 micron.
Rubber Collet Holder Size: H1= 1.6 x 1.6 mm H2= 2.6 x 2.6 mm Other= Customize Size -
Rubber Collet Holder
Die BondingCollet holder is a connected tool for the rubber tip installation, we can provide a variety of collet holder for different sizes and different machines with stainless steel as the main material.
Rubber Collet Holder Size: H1: 1.6 x 1.6 mm H2: 2.6 x 2.6 mm Other: Customize size -
Suction Cup
Die BondingSmall and mid size suction cups for electronic/semiconductor applications. For handling objects with flat or slightly curved surface. Some of the cups are short below cups which can be used in one lifting device which handle objects with height differences and varying shapes.
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Tungsten Carbide Die Collet
Die BondingTungsten carbide die collet are mostly used for eutectic die attach with scrubbing. This tools offers good placement, long lifetime and it is not temperature-sensitive. One common problem is the chipping of the die due to its hardness. LD Microprecision design and produces wide range of high performance die collet with hole size down to 80 micron.
