Capillary Cleaning
LD Microprecision has developed the ultra fine probes that is used in the wafer testing to effectively clean the smallest capillary wire drag holes. We have carried out some development to recycle the used Wire Bond capillary to extend its lifespan by at least 75-100% depending on the touch down usage.
Magnification at 500X ( From 50k bond until 500k bond)
Obviously, even at the initial 50k ” touch down” the tip start exhibiting collection of “dirts”.
The concern is the contamination / metalization accumulated at the tip.
Cleaning of used capillary eliminate or minimize the particle that goes into the wire bond
process that can cause also delamination problem.
ADVANTAGES:
i. Tremendous cost saving
ii. Improve the wire bond quality
Before Cleaning
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After Cleaning
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A regularly clean Wire Bond Capillary will ensure continue good bondability.
From our record, a Wire Bond capillary can averagely be recycled three times against
the normal lifespan where it is discarded e.g at 500k Bond.
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Capillary Unplugging Wire
Wire BondingCapillary unplugging wire offers an easy economical way to unplug clogged capillary. This is especially useful for engineers during bonding evaluation when the optimum process parameters are not defined yet and the gold ball tends to get clogged in the capillary holes. This can be done by simply inserting the tip of the unplugging wire from the top of the capillary and gently raises and lowers the wire within the capillary.
Advantages: i. Save cost ii. User friendly iii. Improve machine uptime iv. suitable for wide range of capillary hole size -
Wire Cutter
Wire BondingWe can provide wire cutters and ribbon cutters for different aluminium wire bonding machines. Our cutters are made from special alloy to ensure the robustness and sharpness with long life characteristic.
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Electronic Flame Off (EFO)
Wire BondingElectronic flame off is used in the wire bonding process where high quality wire bonding is of utmost important. LD microprecision design and manufacture a wide range of EFO wands that is used currently in most wire bonder models in the semiconductor industry. These includes K&S, ASM, Kaijo, Shinkawa etc. Our company seeks igh precision machining and use IRIDIUM materials to extend the life of ignition level and to ensure uniformity and stability in the process.
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Wedge
Wire BondingWedge is mainly used for aluminium wire / ribbon bonding. We can provide wedges for different aluminium bonding machines. We also can provide scientific selection and technical support.