Needle Holder & Pepperpot
We can design the needle holder and pepperpot according to customers’ die bonding machine type, chip size and also with customers’ special requirements. We can support to following die bonders now: ASM / ESEC / Datacon / Panasonic and etc.
Please contact our sales representative for more information about Pepperpot and Needle Holder configuration.
| Product Code | Material Code | Configuration |
|---|---|---|
| PPT | 05 | XX-XXX |
| NH | 03 | XX-XXXX-XXXX |
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High Temperature Pick Up Tool
Die BondingThe Hitemp plastic pick up tools serve the purpose for assembling the small dice especially for die sizes < 25mil. The plastic material is harder then rubber material. This makes it possible to machine the tip to very small and close tolerances to enable accurate placement capabilities. LD Microprecision design, manufacture and market wide range of high-temperature pick up tool with hole size down to 80 micro & tight tolerance spec.
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Epoxy Stamping Tool
Die BondingStamping tools are also called as transfer or printing tools because they really stamp epoxy onto the pad. Unlike the dispensing tool, the epoxy does not flow through the part and onto the pad. The tools pick up epoxy from an epoxy tray and stamps the epoxy down on to the pad. The tools come in various design such as deep groove, cross, star and single dot.
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Suction Cup
Die BondingSmall and mid size suction cups for electronic/semiconductor applications. For handling objects with flat or slightly curved surface. Some of the cups are short below cups which can be used in one lifting device which handle objects with height differences and varying shapes.
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Tungsten Carbide Die Collet
Die BondingTungsten carbide die collet are mostly used for eutectic die attach with scrubbing. This tools offers good placement, long lifetime and it is not temperature-sensitive. One common problem is the chipping of the die due to its hardness. LD Microprecision design and produces wide range of high performance die collet with hole size down to 80 micron.