Electronic flame off is used in the wire bonding process where high quality wire bonding is of utmost important. LD microprecision design and manufacture a wide range of EFO wands that is used currently in most wire bonder models in the semiconductor industry. These includes K&S, ASM, Kaijo, Shinkawa etc. Our company seeks igh precision machining and use IRIDIUM materials to extend the life of ignition level and to ensure uniformity and stability in the process.
