Bond Test Tools

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    Ball / Die Shear

    Ball Shear testing is used to assess the integrity of the gold ball-to-bonding pad interface in the gold ball bonding process. A shear tool moves parallel to the bonded surface and shears the ball bond. We provide various type of ball shear to meet customers' different bond tester such as DAGE, XYZ, Royce, Rhesca and etc.

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    Cold Bump Pull

    LD Microprecision achieved technical breakthrough in the field of complex ultrafine processes manufacturing know-how to produce the tweezer pull with tight tolerance and uncompromising performance results. Application for both solder bump and Wire Bond ball bond vertical pull.

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    Wire Hook

    The wire-bond pull test is the most universally accepted method used to verify the quality of the wire bonding process. Our precision micro machined tips are specially designed for narrow wire pitch of 50 microns and below. Special wire pull material for longer life span and better performance. We provide various type of hook to meet customers' different bond tester such as DAGE, XYZ, Royce, Rhesca and etc.

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