Cold Bump Pull
LD Microprecision achieved technical breakthrough in the field of complex ultrafine processes manufacturing know-how to produce the tweezer pull with tight tolerance and uncompromising performance results. Application for both solder bump and Wire Bond ball bond vertical pull.
| Part Number | Modal | Ball Diameter (μm) | Ball Pitch (μm) |
|---|---|---|---|
| CBP-11-300-500-01 | DAGE | 300 | 500 |
| CBP-11-450-650-01 | DAGE | 450 | 650 |
| CBP-11-450-800-01 | DAGE | 450 | 800 |
* For sizes not found above, we can custom made to meet customer requirements.
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