Suction Cup
Small and mid size suction cups for electronic/semiconductor applications. For handling objects with flat or slightly curved surface. Some of the cups are short below cups which can be used in one lifting device which handle objects with height differences and varying shapes.
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Push Up Needle
Die BondingPush up needle is mostly used in die bonding and die sorting process. Our micro grain material ensures long life application. The polished spherical tip minimized chip or crack die related problem. Full range of tip configurations are manufacture for various applications.
Material : Tungsten Carbide, High Speed Steel, Stainless Steel, Plastic Tip Shank Diameter : 0.70mm , 0.68mm, 0.50mm, 0.40mm Please contact our sales representative for customize or special design request. -
Hybrid Rubber Collet
Die BondingHybrid Rubber is one of our patented product. This collet provide easy, and reliable technique for lifting thin fragile and uneven surface die. Hybrid rubber tip can solves stack die, sticky die and foreign particles on die, and missing die issue. Other than that, its lifespan is longer than normal rubber collet.
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Rubber Collet
Die BondingRubber collet is the most commonly used pick-up tool in the industry. The material is non-conductive and anti-static. Our wide range of rubber pick up tool are widely used in die pick, we provide variety of size to meet different application for normal temperature and high temperature with hole size down to 80 micron.
Rubber Collet Holder Size: H1= 1.6 x 1.6 mm H2= 2.6 x 2.6 mm Other= Customize Size -
Epoxy Stamping Tool
Die BondingStamping tools are also called as transfer or printing tools because they really stamp epoxy onto the pad. Unlike the dispensing tool, the epoxy does not flow through the part and onto the pad. The tools pick up epoxy from an epoxy tray and stamps the epoxy down on to the pad. The tools come in various design such as deep groove, cross, star and single dot.