Suction Cup
Small and mid size suction cups for electronic/semiconductor applications. For handling objects with flat or slightly curved surface. Some of the cups are short below cups which can be used in one lifting device which handle objects with height differences and varying shapes.
Tungsten Carbide Die Collet
Die Bonding
Tungsten Carbide Die Collet
Die BondingTungsten carbide die collet are mostly used for eutectic die attach with scrubbing. This tools offers good placement, long lifetime and it is not temperature-sensitive. One common problem is the chipping of the die due to its hardness. LD Microprecision design and produces wide range of high performance die collet with hole size down to 80 micron.
Hybrid Rubber Collet
Die Bonding
Hybrid Rubber Collet
Die BondingHybrid Rubber is one of our patented product. This collet provide easy, and reliable technique for lifting thin fragile and uneven surface die. Hybrid rubber tip can solves stack die, sticky die and foreign particles on die, and missing die issue. Other than that, its lifespan is longer than normal rubber collet.
Needle Holder & Pepperpot
Die Bonding
Needle Holder & Pepperpot
Die BondingWe can design the needle holder and pepperpot according to customers' die bonding machine type, chip size and also with customers' special requirements. We can support to following die bonders now: ASM / ESEC / Datacon / Panasonic and etc.
Please contact our sales representative for more information about Pepperpot and Needle Holder configuration.
Rubber Collet
Die Bonding
Rubber Collet
Die BondingRubber collet is the most commonly used pick-up tool in the industry. The material is non-conductive and anti-static. Our wide range of rubber pick up tool are widely used in die pick, we provide variety of size to meet different application for normal temperature and high temperature with hole size down to 80 micron.
Rubber Collet Holder Size:H1= 1.6 x 1.6 mmH2= 2.6 x 2.6 mmOther= Customize Size