Electronic Flame Off (EFO)
Electronic flame off is used in the wire bonding process where high quality wire bonding is of utmost important. LD microprecision design and manufacture a wide range of EFO wands that is used currently in most wire bonder models in the semiconductor industry. These includes K&S, ASM, Kaijo, Shinkawa etc. Our company seeks igh precision machining and use IRIDIUM materials to extend the life of ignition level and to ensure uniformity and stability in the process.
ASM | ||
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ASM399 |
ASM-iHAWK |
ASM iHAWK-Extreme
|
ESEC | |
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ESEC 3100 |
ESEC3006
|
K&S | |||
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K&S 1448 |
K&S 8028 |
K&S CONNX |
Ceramic Gas Chamber |
K&S Iconn Plus |
K&S Iconn ATx3 Wand |
K&S Connx Plus |
K&S CONNX |
KAIJO | |||
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Kaijo FB-118 |
Kaijo FB-128 |
Kaijo FB-880/180/150 |
Kaijo |
SHINKAWA | |
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Shinkawa UTC 1000 / 2000 / 3000 / 200/ 300/ 400 / 435 |
Shinkawa UTC 300 |
Shinkawa ACB-35/400CU |
Shinkawa |