Electronic Flame Off (EFO)
Electronic flame off is used in the wire bonding process where high quality wire bonding is of utmost important. LD microprecision design and manufacture a wide range of EFO wands that is used currently in most wire bonder models in the semiconductor industry. These includes K&S, ASM, Kaijo, Shinkawa etc. Our company seeks igh precision machining and use IRIDIUM materials to extend the life of ignition level and to ensure uniformity and stability in the process.
ASM | ||
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![]() ASM399 | ![]() ASM-iHAWK | ASM iHAWK-Extreme
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ESEC | |
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![]() ESEC 3100 | ESEC3006
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K&S | |||
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![]() K&S 1448 | ![]() K&S 8028 | ![]() K&S CONNX | ![]() Ceramic Gas Chamber |
![]() K&S Iconn Plus | ![]() K&S Iconn ATx3 Wand | ![]() K&S Connx Plus | ![]() K&S CONNX |
KAIJO | |||
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![]() Kaijo FB-118 | ![]() Kaijo FB-128 | ![]() Kaijo FB-880/180/150 | ![]() Kaijo |
SHINKAWA | |
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![]() Shinkawa UTC 1000 / 2000 / 3000 / 200/ 300/ 400 / 435 | ![]() Shinkawa UTC 300 |
![]() Shinkawa ACB-35/400CU | ![]() Shinkawa |