Electronic Flame Off (EFO)
Electronic flame off is used in the wire bonding process where high quality wire bonding is of utmost important. LD microprecision design and manufacture a wide range of EFO wands that is used currently in most wire bonder models in the semiconductor industry. These includes K&S, ASM, Kaijo, Shinkawa etc. Our company seeks igh precision machining and use IRIDIUM materials to extend the life of ignition level and to ensure uniformity and stability in the process.
ASM | ||
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![]() ASM399 |
![]() ASM-iHAWK |
ASM iHAWK-Extreme
|
ESEC | |
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![]() ESEC 3100 |
ESEC3006
|
K&S | |||
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![]() K&S 1448 |
![]() K&S 8028 |
![]() K&S CONNX |
![]() Ceramic Gas Chamber |
![]() K&S Iconn Plus |
![]() K&S Iconn ATx3 Wand |
![]() K&S Connx Plus |
![]() K&S CONNX |
KAIJO | |||
---|---|---|---|
![]() Kaijo FB-118 |
![]() Kaijo FB-128 |
![]() Kaijo FB-880/180/150 |
![]() Kaijo |
SHINKAWA | |
---|---|
![]() Shinkawa UTC 1000 / 2000 / 3000 / 200/ 300/ 400 / 435 |
![]() Shinkawa UTC 300 |
![]() Shinkawa ACB-35/400CU |
![]() Shinkawa |