Electronic Flame Off (EFO)
Electronic flame off is used in the wire bonding process where high quality wire bonding is of utmost important. LD microprecision design and manufacture a wide range of EFO wands that is used currently in most wire bonder models in the semiconductor industry. These includes K&S, ASM, Kaijo, Shinkawa etc. Our company seeks igh precision machining and use IRIDIUM materials to extend the life of ignition level and to ensure uniformity and stability in the process.
| ASM | ||
|---|---|---|
 ASM399 |  ASM-iHAWK |
ASM iHAWK-Extreme
|
| ESEC | |
|---|---|
 ESEC 3100 |
ESEC3006
|
| K&S | |||
|---|---|---|---|
 K&S 1448 |  K&S 8028 |  K&S CONNX |  Ceramic Gas Chamber |
 K&S Iconn Plus |  K&S Iconn ATx3 Wand |  K&S Connx Plus |  K&S CONNX |
| KAIJO | |||
|---|---|---|---|
 Kaijo FB-118 |  Kaijo FB-128 |  Kaijo FB-880/180/150 |  Kaijo |
| SHINKAWA | |
|---|---|
 Shinkawa UTC 1000 / 2000 / 3000 / 200/ 300/ 400 / 435 |  Shinkawa UTC 300 |
 Shinkawa ACB-35/400CU |  Shinkawa |
Wedge
Wire Bonding
Wedge
Wire BondingWedge is mainly used for aluminium wire / ribbon bonding. We can provide wedges for different aluminium bonding machines. We also can provide scientific selection and technical support.
Wire Cutter
Wire Bonding
Wire Cutter
Wire BondingWe can provide wire cutters and ribbon cutters for different aluminium wire bonding machines. Our cutters are made from special alloy to ensure the robustness and sharpness with long life characteristic.
Capillary Cleaning
Wire Bonding
Capillary Cleaning
Wire BondingLD Microprecision has developed the ultra fine probes that is used in the wafer testing to effectively clean the smallest capillary wire drag holes. We have carried out some development to recycle the used Wire Bond capillary to extend its lifespan by at least 75-100% depending on the touch down usage.
Capillary Unplugging Wire
Wire Bonding
Capillary Unplugging Wire
Wire BondingCapillary unplugging wire offers an easy economical way to unplug clogged capillary. This is especially useful for engineers during bonding evaluation when the optimum process parameters are not defined yet and the gold ball tends to get clogged in the capillary holes. This can be done by simply inserting the tip of the unplugging wire from the top of the capillary and gently raises and lowers the wire within the capillary.
Advantages:i. Save costii. User friendlyiii. Improve machine uptimeiv. suitable for wide range of capillary hole size